Innovative laser technologies - HiLASE Center

The HiLASE Centre will present two innovative laser technologies at the Technology Village through video demonstrations and laser-processed samples.
HiLASE Centre, a member of the Czech Optical Cluster, will showcase samples of Laser Shock Peening (LSP) and Laser Micromachining (LMM) technologies, along with demonstration videos. The Technology Village is part of the Cluster Day in the Pilsen Region, taking place on 22 October 2025 in Pilsen.
Advanced laser processing and manufacturing technologies use cutting-edge lasers in combination with advanced sensing, feedback control, and machine learning. This includes, for example, surface functionalisation using micro- and nanostructures, enhancing the durability of metal components, or the production of parts using hybrid technologies. Functionalisation means the targeted modification of surface properties—such as friction or biocompatibility—through precisely defined structures. Another important area is the extension of service life and the improvement of safety in critical components by the controlled introduction of residual surface stress. The main technologies used include LSP (Laser Shock Peening), LMM (Laser Micromachining), and LIDT (Laser Induced Damage Threshold).
The cluster supports HiLASE with the transfer of these technologies into Czech industry and connects the centre with company R&D teams that come with specific requirements. Through case studies, we jointly search for solutions, and some examples will be showcased at the booth.
The HiLASE Centre is a research and development centre that offers innovative laser technologies and efficient applications for industry.
Kontakt:
Centrum HiLASE
Fyzikální ústav AV ČR, v. v. i.
Za Radnicí 828
252 41 Dolní Břežany
Email: info@hilase.cz
Social Media: LinkedIn, Facebook
Name of parent cluster organisation:
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Created: 28/08/2025 11:08:12
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